Unleash your Love for Electronics
-Multi layer high speed PCB design
-RF and Battery powered design
-DFM, DFA and DFT
-BOM Optimization
-Power electronics design
-Board Support Packages (BSP)
-Device Driver Development
-Application Software Development
-OS porting/migration
-Enclosure Design
-3D Modelling
-IP rated design
-Thermal Analysis and Testing
-Stress and Vibration Testing
8 Weeks
16 Sessions
48 Hours
- Embedded Product Development Lifecycle
- Hardware Engineer Roles and Responsibilities
-Component selection parameters: Active and Passive, Sensors
-Circuit Analysis: Resistor networks, LC circuits, Diode and Mosfet based circuits
-Online Component Search
-Schematic symbol creation, Schematic drafting, Netlisting
-PCB terminologies and manufacturing process
-Layer stackup, Component placement and fanout, Routing, Gerber Generation
-Architecture, Clock and Reset, ADC, GPIOs, Memories
-DC Analysis, Open drain and Push pull logic
-JTAG and SWD debugging
-RTC and Watchdog
-I2C, UART, SPI, CAN
-Interface study using protocol analyser
-Linear and LDO (Low Dropout) regulators
-Buck and Boost converter (Synchronous and Non-Synchronous)
-Charge pumps
-PCB Dimensions and Geometry
-Electromechanical Component selection: Connector and Cable assembly, Switches
-Reverse Engineering commercial electronic products
-Soldering TH and SMD components
-Equipment Training: Multimeter, Clamp meter, RPS, Autotransformer and Oscilloscope
-Project: Schematic and PCB design of mini electronic modules
10 Weeks
20 Sessions
60 Hours
-RS232, RS422, RS485
-Protocols: SD, SDIO, SATA, USB3.0 and PCIe
-Connectors and Cable assembly for high speed signals
-Filters and ESD for high speed signals
-Volatile: DDR DRAM, SDRAM, SRAM
-Non Volatile: NAND and NOR Flash, eMMC, SD
-ARM architecture, CPU, GPU, DSP
-Clock and Reset
-Interface and GPIO Mapping
-Flashing and Debugging
-Bootflow and Boot loader
-Power sequence, Power consumption calculations
-Power Management ICs (PMICs)
-Bus and differential signal drafting, Setting contraints and Design Rule Checks
-Impedance controlled PCB, Length Matching, Serpentine routing, Arc routing
-USB to UART, USB to SPI
-USB, Ethernet and PCIe switches
-USB Hub
-Stability and compensation
-Reducing Overshoots and Ripples
-Losses calculation in power circuits
-Thermal parameters of different IC packages
-Thermal optimization in PCB
-Cooling techniques (Heatsinks, Fan, etc)
-Thermally viable mechanical design
-Visual Inspection, Impedance and Voltage measurement
-Clock, Reset and power sequence validation
-Power circuit validation
-Timing Analysis,Throughput analysis
-Soldering SMD ICs
-Board BringUp and Design Validation Testing
-Project: Schematic and PCB design of Controller based applications
12 Weeks
24 Sessions
72 Hours
-HDD, SSD
-Frequency bands and Spectrum
-RF, RFID, NFC, WiFi, Bluetooth, Zigbee, LoRAWAN
-GSM, LTE, VOLTE, NB-IOT
-Antenna types and selection
-Antenna matching network, Balun, PA, LNA, RF capacitors
-RF Mechanical Design
-Introduction to test equipments: VNA, Spectrum Analyser
-Pre and post SI analysis
-Impedance control and matching,Transmission lines, Reflections, Differential lines, Crosstalk
-PDN, DC and AC PI analysis, Decoupling capacitor optimization
-Layout considerations to improve SI and PI
-Layout considerations to reduce EMI
-FCC, CE, UL
-RoHS, REACH
-POE, USB PD, QuickCharge
-Flyback and Forward converter design
-Cell chemistry, voltage and capacity
-Maximizing battery life
-Design rules for Manufacturing optimization
-Design rules for Assembly optimization
-Design rules for Testing optimization, PTS (Production Test System) Designs
-IP rating, Stress and Vibration tests
-Soldering and Desoldering SMD packages
-Project: Schematic and PCB design of processor based applications
Contact us and we'll get back to you within 24 hours.
83, Arunachalam St, Chintadripet, Chennai-600 002
+91 9791 653 753
akash.s@muphile.com
GSTIN: 33BPJPA9082H1ZV